1. What can we offer?
We provide emerging semiconductor services for global customers from a Singapore based company with our semiconductor partners.
2. What is our differentiator and secret sauces?
Emerging semiconductor services offered with Intellectual property (IP) assets protection. From prototyping and mass production capability with PDK released after development and validation.
1. RF GaN-on-SiC MMIC technology
a. 0.15µm MMIC technology with 50µm wafer thickness after backgrind.
b. 0.25µm MMIC technology with 75µm wafer thickness after backgrind.
2. Lithium Niobate photonic technology
a. 8” with passive and active photonics integration.
b. Capability including ultra-high-performance modulator offering.
RF GaN-on-SiC MMIC technology
Lithium Niobate photonic technology
3. Exclusive laser source distributorship & optoelectronics packaging solution with partners
Micro-ITLA(Micro-Integrated Tunable Laser Assembly): This laser module consists of a tunable laser device, driver circuits, temperature and laser control circuits with wavelength calibration being stored in a flash memory, and an interface circuit following Multi-Supplier-Agreement (MSA) for our tunable laser module to be used with hot-swappable with other supplier products. It requires dimensions of 37 x 25 x 7.5 mm3 per MSA standard
Nano-ITLA (Nano-Integrated Tunable Laser Assembly): This laser module consists of a tunable laser device, driver circuits, temperature and laser control circuits with wavelength calibration being stored in a flash memory, and an interface circuit following Multi-Supplier-Agreement (MSA) for our tunable laser module to be used with hot-swappable with other supplier products. It requires dimensions of 25 x 15.7 x 7.5 mm3 per MSA standard